The key point of diamond segment bond

The bonding agent for diamond segment is composed of basic metal elements, such as iron, copper, cobalt, and silicon carbide. These are the most abundant metal elements, also known as iron-based, copper-based, cobalt-based and silicon carbide-based , And these four common carcass binders are also used as the main materials of the segment binder, and they are widely used. Other elements include nickel, aluminum, chromium, titanium and other elements. The weight and quantity of the elements are relatively small, and these materials are highly replaceable, and there are many types. The diamond segment produced have also undergone many changes. So what are the specific elements of matrix binder?

The first point: the chemical holding power of the matrix, the diamond matrix bond is initially powder, and the solid metal has no chemical holding power. Through high temperature sintering, the metal powder of the matrix begins to melt, and then in the process of high pressure, diamond appears slight carbonization, while during the matrix binder melts process, the metal elements continue to chemically react to form a dense metal block structure. In this process, the chemical control of the matrix begins to be greatly improved, and various metal element of diamond forms a tightly fixed structure with diamond, the diamond and the metal bond are firmly combined, so this kind of segment will not drop out, and due to the chemical holding force, the segment is in the cutting process , the diamond can be used to the maximum, thereby extending the life of the diamond segment, and in efficiency, there is also an improvement.



The second point: the physical holding power of the matrix. During the sintering process of the diamond segment , and the sintering process of the matrix under high temperature and high pressure, the metal and diamond powder form a fully enclosed physical environment. Under this package, the metal material and diamond forms natural physical stress, which is also called physical holding force and mechanical holding force. The size of the physical holding force depends on the material hardness of the metal matrix bond. The higher the material hardness, the higher the holding force. Of course, the physical holding force of the matrix also depends on the shape of the diamond. The holding force of an octahedron is higher than that of a quadrilateral. The mechanical holding force also needs to be determined according to the elasticity of the matrix binder. The more elastic the metal binder, it can rebound appropriately when subjected to strong impact. The unique physical properties of this metal can also greatly improve the  physical control of the diamond matrix.

The third point: the wear resistance of the matrix bond is to increase the life of the matrix. In addition to the holding force, the wear resistance of the matrix bond is very important. The wear resistance is not enough. The diamond matrix is in the process of processing. The body consumption is much faster than the consumption of diamond, which leads to the premature shedding of diamond. Such a product has a very short life span and is unqualified. However, if the wear resistance of the carcass bond is too high, the diamond will be ground flat, the edge will not be easy to cut, and the cutting will not move. This situation is also not conducive to the cutting of the segment. However, if the wear resistance of the matrix bond can be kept close to or convergent with the wear resistance of diamond, then the efficiency and life of the diamond can reach the best state during processing.



In addition to the above three points, the matrix binder also needs to be easy to weld, tolerate high temperatures as much as possible, and have strong stability. These are several factors that can directly affect the quality of the diamond segment.