During the cutting process of the diamond segment, the holding force of the segment metal bond on the diamond is an inseparable problem. How to increase the holding power of cobalt matrix bond to diamond? This is the problem to be solved in this article.

At present, the most widely used for cutting hard and brittle stone is circular multi-blade stone cutting machine. In order to improve the utilization rate of stone blocks, reduce the sawing gap and improve the processing efficiency, the high-speed sawing technology of ultra-thin saw blades has been favored by the stone processing industries But the ultra-thin saw blades also encountered many problems in the cutting process. This paper mainly focuses on the impact of ultra-thin saw blades on stone cutting.

At the end of the twentieth century, the technology of laser saw blades began to develop. At present, due to the advantages of laser saw blades, it has gradually been widely used and promoted and has become a necessary diamond tool for many cutting materials. This article will describe its impact and significance on the diamond cutting industry by introducing laser saw blade products and its advantages and disadvantages.

Diamond circular saw blade is a kind of diamond inserted in the diamond segment through high temperature and high pressure. Through the diamond fixed in the diamond segment, diamond saw blade cut some hard materials, such as stone, concrete, asphalt, ceramic tile and other materials. Although diamond saw blades are very common, many people do not know the correct way to use saw blades. This article answers the daily use of diamond circular saw blades and cutting problems through question and answer.

In the process of stone cutting, the medium diameter saw blade plays a very important role. It can usually cut slabs into various specifications. Certainly, in the process of cutting stone, this medium-diameter saw blade tool is different from a large saw blade. In addition, the production process of the diamond segment and the selection of the base also have unique manufacturing technology. This article introduces the cutting process of large saw blades and the cutting process of medium diameter saw blades, so that everyone can better understand the production technology of diamond circular saw blades.

The raw materials of diamond segments are mainly diamond and metal powder. In terms of powder, the content of metal powder is used as the material base. Most of the early segments are cobalt bond. The appearance of copper bond diamond segments has greatly reduced the manufacturing cost of the diamond segments, making the synthetic diamond segments more cost-effective.

At present, with the increasing development of synthetic diamond technology, the products of diamond stone cutting tools also show a dazzling development. But how to grasp the core of diamond cutting tools and how to choose the preferred parameters of diamond cutting tools are questions that every customer who wants to buy diamond tools needs to consider.

During the stone cutting process, various problems will be encountered. The bending of the stone slab is one of the common problems. So why does the stone slab bend? how to solve this problem? It is the problem to be solved in this article.

Diamond wire saw is a kind of diamond tool used for quarrying. This article will introduce some problems and solutions that often occur in the cutting process of diamond wire saw, so that people can use diamond wire saw better.

During the cutting process of the mine wire saw, there are many matters that need to be paid attention to, especially some matters will directly affect the cutting efficiency and quality.

Diamond wire saws are often used in granite mining. What are the sizes and specifications of this wire saw? Let's take a look.

The diamond wire saw is a tool commonly used in stone mining. Currently, it is mainly used in the mining of granite mines, marble mines and quartz stone mines. What are the advantages of diamond wire saw compared to other mining methods? This article will introduce in detail.